Solder Paste, Synthetic No Clean, 138 °C, 42, 57.6, 0.4 Sn, Bi, Ag, 50G
₹3,271.00 + ₹588.78 GST
₹3,859.78 (Incl. of all taxes)
In stock
Overview
No-clean, lead-free, low temperature solder paste in 50g jar.
Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components
Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Clear residue
Low voiding
Excellent wetting compatibility on most board finishes
Dispense grade
Compatible with enclosed print heads
Alloy: Sn42/Bi57.6/Ag0.4
Shelf life:
| HSN Code | 90118000 |
|---|---|
| Brand | CHIP QUIK |
| Usually dispatched in | 1-2 WEEKS |
| Pack Size | 50 g |
No-clean, lead-free, low temperature solder paste in 50g jar.
Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components
Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Clear residue
Low voiding
Excellent wetting compatibility on most board finishes
Dispense grade
Compatible with enclosed print heads
Alloy: Sn42/Bi57.6/Ag0.4
Shelf life:
Write Your Own Review